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Evaporator system

EVT-820

조인테크놀러지에서 개발하여 공급하는
“Si wafer thin & SiC wafer process” 관련 전문 설비입니다.

Introduction

전자빔(E-beam)을 사용하여 다양한 metal을 증착시키는 설비입니다.

E-Beam을 사용하여 증착하며, double chamber 구성으로 빠른 batch process가 가능합니다.

Fron metal, back metal

  • Wafer loading capacity
    200 mm, 9 wfs / batch
    150 mm, 1 5 wfs / batch
  • Dome type
    Lift-off separate dome
  • Dual chamber specification
    Process chamber
    Lift-off dome, Ion milling source, Dual view port, Inficon crystal sensor, Cryopump
    Source chamber
    Temescal 4 crucible, Single viewport, Inficon gauge
  • Control system
    Auto sequence
    PC controlled system
    Deposition controller
    Inficon XTC-3
    E-Beam power supply
    Temescal CV-6SLX
    Ion milling
    Veeco
    Temescal E-Beam controller with HVPS, FPS, and sweep controller

Detail view

System layout

Process chamber

System GUI (1)

System GUI (2)